Licensable Single-Substrate Wet-Cleaning Process-Technology for Device Manufacturing.
Applications include photoresist & residue removal, oxide growth, post-CMP cleaning, copper passivation,
and non-damaging cleaning of SiCOH low-k dielectric materials in a single-wafer wet-processing tool for semiconductor device
manufacturing.
Phifer Smith Corporation supplies process technology IP and selected key hardware components to enable customers to rapidly
integrate HotOzone™ and CuprOzone™ technology into their manufacturing systems.
Our IP is available not only to equipment companies but also to device manufacturers.
