SEMICONDUCTOR DEVICE MANUFACTURING APPLICATIONS
FEOL: single-wafer wet processing
- Post-Etch Photoresist Removal
- Post-Etch Residue Removal
- Post-Litho Resist Removal (Rework)
BEOL: single-wafer wet processing
- Post-Etch Photoresist Removal
- Post-Etch Residue Removal
- Post-Litho Resist Removal (Rework)
- Post-CMP Organic Cleaning
- Post-CMP Copper Passivation
BACK-END: single-wafer wet processing
- Residue Removal
- Copper Passivation
Glossary of Terms:
FEOL: front-end-of-line (transistor formation steps)
BEOL: back-end-of-line (interconnect formation steps)
